本公司長期供應貨源穩定，價格優惠，質量保證，歡迎來電咨詢「PA6 8333GHIHS」ˉA, low heat <177 Polyplastics A430, Rodrun? LC3000 B, 177 ~ 243 in heat 6330 U. S. DuPont, Japan Polyplastics A130, Japan MITSUBISHI E335G30, Japan Sumitomo E7000, Rodrun? LC5000, Ueno, LCP? C, 1000 -930, high heat resistant >243 Xydar? DuPont; 6130 the treasure C130, Ueno LCP? Titan LCP®, 2000; LG431, Japan MITSUBISHI E345G30 two, a, electrical and electronic applications is the main market for LCP: surface mount electronic and electrical welding dimension stability and resistance of materials have high requirements (can use to surface assembly technology in gas phase infrared welding and welding), B; LCP: a printed circuit board, satellite electronic components, jet engine parts, auto parts, medical; C, LCP with high filler or alloy (PSF/PBT/PA): as an integrated circuit Packaging material, packaging material for the coil skeleton of the epoxy resin, and the sheath of the optical fiber cable joint and the high strength element; the filling material in the separation column used for the chemical industry with the ceramic. Instead of polysulfone glass fibre reinforced plastic (brake system of automobile panel, spacecraft external outboard)